• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:

    公开号:BR112013024398B1
    申请号:R112013024398-8
    申请日:2012-03-23
    公开日:2018-11-06
    发明作者:Masato Shimamura；Tsukasa Ohnishi；Mitsuhiro Kousai；Kazuyori Takagi；Tomoko Nonaka；Masayuki Suzuki；Toru Hayashida；Seiko Ishibashi；Shunsaku Yoshikawa；Yoshie Yamanaka
    申请人:Senju Metal Industry Co., Ltd.；
    IPC主号:
    专利说明:

    (54) Title: WELDING ALLOY, WELDING PASTE, WELDING WITH FLOW NUCLEUS, WELDING SPHERE AND LEAD FREE PREFORM (73) Holder: SENJU METAL INDUSTRY CO., LTD .. Address: 23 SENJU-HASHIDO-CHO, ADACHI -KU, ΤΟΚΥΟ 1208555, JAPAN (JP) (72) Inventor: MASATO SHIMAMURA; TSUKASA OHNISHI; MITSUHIRO KOUSAI; KAZUYORI TAKAGI; TOMOKO NONAKA; MASAYUKI SUZUKI; TORU HAYASHIDA; SEIKO ISHIBASHI; SHUNSAKU YOSHIKAWA; YOSHIE YAMANAKA.
    Validity Period: 20 (twenty) years from 03/23/2012, subject to legal conditions
    Issued on: 11/06/2018
    Digitally signed by:
    Liane Elizabeth Caldeira Lage
    Director of Patents, Computer Programs and Topographies of Integrated Circuits
    1/18
    Descriptive Report of the Invention Patent for WELDING ALLOY, WELDING PASTE, WELDING WITH FLOW NUCLEUS, WELDING BALL AND LEAD FREE PREFORM.
    Technical field [001] This invention relates to a lead-free solder alloy and particularly a lead-free solder alloy which is suitable for a solder paste used for surface mount substrates and for flux core solder used for repairs.
    Background of the Technique [002] Welding methods for electronic parts include welding with a soldering iron, flux soldering, reflux soldering, and the like.
    [003] Reflow soldering is a method in which a solder paste comprising solder powder and a flux is supplied only to the required locations on a printed circuit board or with a distributor, the electronic parts are placed in the portions coated, and then the solder paste is melted in a heating device such as a reflux oven to solder the electronic parts to the printed circuit board. In the reflux method, not only is it possible to weld a large number of locations in a single operation, but bridging does not occur even if the electronic parts are welded with a narrow distance and the weld does not adhere to unnecessary locations. In this way, welding can be carried out with excellent productivity and reliability.
    [004] In the past, a Pb-Sn alloy was used in welding. This Pb-Sn alloy has a melting point of 183 ° C for a eutectic composition (Pb-635n), so that it has little thermal effect even in electronic parts having little thermal resistance. Additionally, it has excellent welding capacity. In this way, it has the
    Petition 870180067144, of 08/02/2018, p. 5/27
    2/18 advantages that it produces few welding defects such as non-welded portions or shrinkage.
    [005] However, due to the problem of Pb toxicity, a strong demand has developed in recent years in the electronic equipment industry for the so-called lead-free solder that does not contain Pb.
    [006] Lead-free solders that are currently used widely are those having a Sn-Ag-Cu Composition as described in JP 5-050286 A, which contains 3 - 5 wt% Ag and 0.5 - 3 wt% Ass. Because this lead-free solder has superior thermal cycle properties and creep properties compared to a conventional Sn-Pb solder, its use is spreading. In particular, the thermal cycle properties are an important factor in evaluating the lifetime of electronic devices in products under warranty.
    [007] Lead-free solder alloys currently used having a Sn-Ag-Cu composition are hard compared to conventionally used SnPb solder. In this way, when they are used on small devices such as mobile phones and if the devices fall accidentally, cracks develop at the interface between the electronic parts and the solder joints, so that these welds have the problem of the so-called interface peeling (interfacial peeling) occur. The interface peeling (interfacial peeling) does not occur immediately with the substrates welded by the flux weld in which a relatively large amount of weld is used in the weld joints.
    [008] However, it occurs easily with substrates that are soldered by reflow soldering and that have tiny joints formed using a small amount of solder.
    [009] Reflow soldering of substrates is performed using paste
    Petition 870180067144, of 08/02/2018, p. 6/27
    3/18 welding, welding balls, welding preforms, and the like. In addition, flux core weld is used to repair weld joints. The printed circuit boards on which these welding materials are used produce the problem of interface peeling particularly easily.
    [0010] The present applicant has described a solder alloy having an Ag content of 0.8 - 2.0% by weight, an Cu content of 0.05 - 0.3% by weight, and still containing In, Ni , Pt, Sb, Bi, Fe, Al, and P as a solder alloy having good drop impact resistance (impact resistance due to drops) for use in Cu root solder (WO 2006/129713 Al).
    [0011] As a solder alloy having excellent resistance to thermal cycles, they also described a lead-free solder based on Sn-Ag-Cu-Bi which is a solder alloy based on Sn-AgCu containing solid solution elements and which has an alloy structure at room temperature comprising a supersaturated solid solution or a solid solution in which the solid solution elements are precipitated and which has an alloy structure at a high temperature in a cycle environment comprising a solid solution in which the elements of solid solution precipitated at a low temperature are redissolved in the Sn matrix (WO 2009/011341 A1).
    [0012] A solder alloy is also described in which Bi and Sb are added to a Sn-Ag-Cu solder composition in such a way that Bi and Sb form solid solutions with Sn and Ag, and Cu forms intermetallic compounds with Sn , through which the mechanical resistance is maintained by the microstructure formed from these solid solutions and intermetallic compounds (JP 9-327790 A).
    Prior Art Documents
    Patent Documents
    Petition 870180067144, of 08/02/2018, p. 7/27
    4/18 [0013] Patent Document 1: WO 2006/129713 Al [0014] Patent Document 2: WO 2009/011341 Al [0015] Patent Document 3: JP 9-327790 A
    Summary of the invention
    Problems the Invention Must Solve [0016] It cannot be said that a lead-free solder alloy has good resistance to drop impact and particularly good resistance to the impact of dropping weld joints having a small welded area. Recent electronic devices are becoming higher performance and smaller in size. As a result, electronic parts used in devices are also becoming smaller and performing better. Despite the increase in the number of electrodes in recent electronic devices, the total size of the devices is becoming smaller. The weld joints formed on the electrodes of electronic parts that are becoming smaller, thus are also becoming smaller. However, if the soldering of small solder joints made of lead-free solder has little resistance to impact from dropping, the solder joints will come off easily when electronic devices receive an impact due to a drop, and electronic devices will no longer be able to function.
    [0017] This problem does not occur immediately with portable electronic devices such as remote controls, which have relatively large printed circuit boards that are soldered by flux welding to which a large amount of solder is adhered. However, in the case of products such as mobile phones or mobile computers that are small and have a high density of parts and are exclusively welded by reflow soldering using a solder paste or solder balls, the amount of solder used for solder joints it is extremely small.
    Petition 870180067144, of 08/02/2018, p. 8/27
    5/18 [0018] The thermal cycle properties of electronic devices are an important factor in determining the average life of electronic devices. Mobile phones and portable computers are not always used in rooms with good air conditioning, and it is not uncommon to use them in high temperature environments such as in a car, or in low temperature environments such as outdoors in snowy weather . In this way, excellent thermal cycle properties are essential, and the solder used for portable devices must have excellent thermal cycle properties.
    [0019] That is, depending on the environment of use of electronic devices, the solder joints used in the electronic devices expand and contract repeatedly, the cracks enter the weld joints, and in the end the weld joints are destroyed. This phenomenon is generally referred to as thermal fatigue. There is a demand for a solder alloy for use in mobile phones and portable computers that does not develop thermal fatigue and that has good thermal cycle properties.
    [0020] However, it cannot be said that the weld that has excellent resistance to impact by drop also has excellent thermal cycle properties. For example, a conventional solder alloy that takes into account drop resistance, such as that described in Patent Document 1, reduces the content of Ag and Cu in a Sn-Ag-Cu Solder in order to prevent thickening of inter-metallic compounds such as Cu6Sn5 and Ag3Sn that develop at the interface between the electrodes and the weld joints, thereby preventing peeling from occurring at the interface between the electrodes and the weld joints and ensuring resistance to impact by drop. However, if the content of Ag and Cu in a conventional solder alloy based on Sn-Ag-Cu-Bi is decreased, although the resistance to impact by drop increases, it develops the problem that the properties
    Petition 870180067144, of 08/02/2018, p. 9/27
    6/18 thermal cycle, which are superior for a Sn-Ag-Cu solder alloy, ends up getting worse. In this way, a solder alloy that is good both in thermal cycle properties and in resistance to impact from falling has not been developed.
    [0021] The problem to be solved by the present invention is to provide a solder alloy having excellent resistance to drop impact while maintaining the thermal cycle properties that are characteristic of a solder alloy based on Sn-Ag-Cu-Bi.
    Means for Solving Problems [0022] The present inventors have found that if a Sn-Ag-Cu-Bi based solder alloy has a composition having a Cu content removed from the surroundings of the eutectic, the thermal cycle properties worsen, whereas the composition in which Ag is removed from the vicinity of the eutectic worsens thermal cycle properties less than when Cu is removed from the eutectic. In addition, thermal cycle properties are improved by adding In along with Bi and Sb instead of decreasing the Ag content. As a result, they completed the present invention.
    [0023] The present invention is a lead-free solder alloy characterized by essentially consisting of 0.2 - 1.2% by weight of Ag, 0.6 - 0.9% by weight of Cu, 1.2 - 3, 0% by mass of Bi, 0.02 1.0% by mass of Sb, 0.01 - 2.0% by mass of In, and a remainder of Sn.
    [0024] When a weld joint of an electronic device is subjected to thermal cycles, the weld structure of the weld joint is thickened. In this way, a fine weld structure generally has excellent thermal cycle properties. In Patent Document 3, the Ag content of the solder alloy used in the examples is 3.0% by mass or 3.4% by mass, so that the solder alloy has an Ag content close to the eutectic composition. In the present invention,
    Petition 870180067144, of 08/02/2018, p. 10/27
    7/18 the Ag content is set at 0.2 -1.2% by mass in order to transmit resistance to impact by drop. If the composition of the solder alloy consisted essentially of Sn, Ag, Cu, Bi, and Sb, the thermal cycle properties would not be good. In this way, in the present invention, adding In along with Bi and Sb to a Sn-Ag-Cu solder alloy composition, even if the Ag content is made at a low value of 0.2 -1.2 wt% , not only is there little thermal fatigue in the same way as with a conventional Sn-Ag-Cu-Bi-Sb composition, but unexpectedly a solder alloy having good thermal cycle properties is obtained.
    [0025] The In (indium) that is added to a solder alloy according to the present invention is a metal that forms a solid solution with Sn in the same way as Bi and Sb. The indium that is added to a solder alloy according to the present invention has a lower atomic weight than Bi or Sb, which also form a solid solution with Sn. In this way, due to the entry of In between the atoms of Bi or Sb, it is possible to form a solder alloy of a solid solution of reinforced type having excellent resistance to thermal cycles. Particularly, if the Bi content that has the highest atomic weight between Bi, Sb, and In is at least twice the content of In in atomic percentage, that is, if the Bi content of mass% is at least approximately four times greater than for In, the thermal cycle properties are further improved due to the entry of In into the gaps between the Bi atoms. More preferably, the content of Bi is at least 3 times the content of In in atomic percentage.
    [0026] However, like Zn and similar elements, In has violent reactivity. If In is used in a solder paste, the solder paste is considered difficult to handle because it is susceptible to changes in the viscosity of the solder paste over time. In the present invention, limiting the Na content that is added to an alloy of
    Petition 870180067144, of 08/02/2018, p. 11/27
    8/18 solder and limiting the organic acid used in a solder paste flow, it is possible to use the solder alloy in a solder paste.
    Effects of the invention [0027] A solder alloy according to the present invention makes it possible to obtain a portable device having excellent resistance to impact by drop, so that the solder joints are not damaged even when a portable device having a welding pattern thin is dropped. In addition, a solder alloy according to the present invention makes it possible to obtain a portable device that has excellent thermal cycling properties and that does not develop thermal fatigue even when used in a high temperature environment such as in a sun-heated vehicle. , or in a low temperature environment such as outdoors in snowy weather.
    [0028] Although a solder alloy according to the present invention contains In, even if a solder alloy according to the present invention is formed as a powder and transformed into a solder paste, it is possible to obtain an excellent solder paste which experiences little change in viscosity over time. Modes for Carrying Out the Invention [0029] Generally, in a lead-free solder based on Sn, Ag is effective in providing resistance to thermal cycles, but if a large amount of Ag is added, the impact resistance to drop decreases. In a lead-free solder according to the present invention, if the added amount of Ag is less than 0.2% by mass, the amount of the Sn-Ag intermetallic compounds formed in the solder alloy is insufficient, and the refining effect the weld structure and, thus, the effect of improving resistance to thermal cycles is not achieved. If the added amount of Ag exceeds 1.2% by mass, a large amount of intermetallic compound
    Petition 870180067144, of 08/02/2018, p. 12/27
    9/18
    Ag3Sn is formed inside the weld and a mesh-like structure is obtained, in such a way that the strength of the material increases and the impact resistance worsens. In this way, the added amount of Ag is established at most to 1.2% by mass. The added amount of Ag in a solder alloy according to the present invention is 0.2 - 1.2% by weight, and more preferably the added amount of Ag in a solder alloy according to the present invention is 0.5 -1.0% by weight.
    [0030] If the Cu content in a lead-free solder according to the present invention is less than 0.6% by mass, the amount of Sn-Cu intermetallic compounds formed in the solder alloy is insufficient, and the effect refining the weld structure and, thus, the effect of improving resistance to thermal cycles are not realized. If the Cu content is greater than 0.9% by mass, when the solder solidifies, a layer of Cu6Sn5 intermetallic compound becomes primary crystals and the solder melting properties are impaired. In this way, the amount of Cu added in a solder alloy according to the present invention is 0.6 - 0.9% by mass and preferably 0.7 - 0.8% by mass.
    [0031] If the content of Bi in a weld according to the present invention is less than 1.2% by mass, the amount of solid solution Bi formed with Sn in the weld alloy is small, such that the effect to improve the thermal cycle properties is not obtained. However, if the Bi content is greater than 3.0% by mass, the weld hardness increases abruptly and the ductility disappears, causing the impact resistance to drop to become low. In this way, the added amount of Bi is set at a maximum of 3.0% by mass. The added amount of Bi in a solder alloy according to the present invention is 1.2 - 3.0% by weight, and preferably the added amount of Bi in a solder alloy of
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    10/18 according to the present invention is 1.5 - 2.0% by weight. Most preferably, the lower limit of Bi is 1.6 mass%.
    [0032] If the Sb content in the present invention is less than 0.02 mass%, the amount of solid solution Sb formed with Sn in the solder alloy becomes too small to produce the effect of improving thermal cycle properties. On the other hand, if the Sb content is greater than 1.0% by mass, the intermetallic compound AgSb is formed in the weld, causing the impact resistance to drop to worsen.
    [0033] In addition, if the Sb content is greater than 1.0% by mass, the weld's wettability worsens and the formation of voids increases. In this way, the added amount of Sb is set at a maximum of 1.0% by mass. The added amount of Sb in a solder alloy according to the present invention is 0.02 - 1.0% by mass, and the added amount of Sb in a preferred solder alloy according to the present invention is 0 , 15 - 0.5% by weight.
    [0034] The addition of In to a solder alloy has the effect of improving the thermal cycle properties. However, because In is an easily oxidizable metal, a solder alloy that contains it is easily oxidized. As a result of the oxidation of the In, yellowing of a welded alloy occurs and they end up developing voids in the weld joints. In this way, it is necessary to limit the amount of In added. In addition, if a solder alloy containing In is formed as a powder and mixed with a flux to form a solder paste, the In and the flux react and cause the The viscosity of the solder paste will vary easily over time.
    [0035] If the content of In in the present invention is lower than 0.01% by mass, the amount of solid solution of Sn and In formed in the solder alloy is small, and the effect of improving the thermal cycle properties is not accomplished. On the other hand, if the content of In is greater than
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    11/18 than 2.0% by mass, the yellowing of the surface of the weld ridges develops after the reflux of the heating and the occurrence of voids also increases, which is undesirable. The added amount of In in a solder alloy according to the present invention is 0.1 - 2.0% by weight. Preferably, the added amount of In in a solder alloy according to the present invention is 0.2 0.5% by weight.
    [0036] A solder paste from a solder alloy containing In easily undergoes changes in viscosity over time because In is a highly reactive metal. By limiting the content of In, a solder alloy according to the present invention prevents changes in a solder paste over time, and a reaction between the flux and the solder powder containing In can be avoided by using a special flux for In .
    [0037] A flow according to the present invention is a flow containing a resin, a solvent, a thixotropic agent, an activator, and an organic acid as an auxiliary activator. The organic acid used as an auxiliary activator is selected from organic acids having low reactivity with In such as succinic acid, adipic acid, and azelaic acid. As a result, a change in viscosity of a solder paste over time due to a reaction between a flux and the solder powder can be avoided. The auxiliary activator is added to a flow to increase its wettability when the amount of halides and the like, used as the main activator, is limited in order to increase corrosion resistance. The auxiliary activator is added as an activator that does not contain a halogen element. [0038] If the total amount of succinic acid, adipic acid, and azelaic acid used in a flow according to the present invention is less than 0.5% by mass, the effect of the auxiliary activator is not obtained, through the that wettability is poor and there are many defects such as solder balls. If it is added in a quanti
    Petition 870180067144, of 08/02/2018, p. 15/27
    12/18 of 5% by mass or greater, even with an organic acid having low reactivity with In such as succinic acid, adipic acid, or azelaic acid, the acid reacts with In and changes over time, consequently, the total amount of succinic acid, adipic acid, and azelaic acid added to a flow in the present invention is at least 0.5% by weight and less than 5.0% by weight.
    [0039] A solder alloy according to the present invention can be used not only as a solder paste as described above, but can be used in the form of solder balls, flux-cored solder, or a preform of solder.
    Examples [0040] Solder powders having solder compositions (mass%) of the examples and comparative examples in Table 1 and a stream having the composition flow of Example 13 in Table 2 were mixed to prepare a solder paste, and a test thermal cycling was performed when resistors of size 3216 having electrodes coated with Sn were mounted on a printed circuit board. In addition, a drop impact test was carried out using a CSP having welding spheres with a diameter of 0.3 mm for assembly, which was similarly mounted on a printed circuit board.
    [0041] The results of the thermal cycle test and the drop impact test are shown in Table 1 below.
    [0042] In Table 1, Comparative Example 2 is a solder alloy composition as described in Patent Document 1, Comparative Examples 3 and 4 are solder alloy compositions as described in Patent Document 2, and Comparative Example 5 is a solder alloy composition as described in Patent Document 3.
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    Drop Impact Test [0043] An impact was transmitted between a CSP having weld dampers formed on it and a printed circuit board per drop, and the number of drops was measured until cracks in the weld joints developed. The circuit board was left at room temperature for 5 days after welding. The number of falls when electrical resistance increased by 50% from the initial value was recorded as an indication of the progress of the cracks.
    [0044] The steps in the crash impact test were as follows.
    [0045] A flow was printed on a csp having the external dimensions of 12x12 (mm) and 196 electrodes in dampers with Ni / Au electrolytic coating, and were placed in the same solder spheres having the compositions shown in Table 1 and a diameter of 0 3 mm.
    [0046] The CSP having solder spheres placed in it was heated in a reflux oven to form solder bumps on the electrodes.
    [0047] The CSP and that the solder bosses were formed was mounted in the center of a printed fiberglass circuit board that measured 30 x 120 (mm) and in which a solder paste was applied, and was heated in a reflow oven to solder the CSP to the printed circuit board.
    [0048] Both ends of the printed circuit board on which the CSP was soldered were attached to a drop template with a spacing of 1 cm from the drop template.
    [0049] The drop template was thrown from a height in order to transmit 1500 G acceleration to the drop template in order to give an impact to the printed circuit board. At that time, the printed circuit board attached to the drop template on both
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    14/18 its ends vibrated at its center, and as a result of this vibration, an impact was transmitted to the solder joints between the printed circuit board and the CSP. The number of falls in that drop test was measured until cracks in the CSP weld joints developed. The test results were recorded at six points and the lowest value was recorded.
    Thermal Cycle Test [0050] The test method was prescribed by J IS C 0025. The effect of repeatedly applying temperature variations in the form of a high temperature and a low temperature to the weld joints was investigated. The result of this test is used as an index of the lifetime of the electronic equipment.
    [0051] The steps in the thermal cycle test were as follows.
    [0052] Resistors having the external dimensions of 3.2 x 1.6 (mm) and electrodes plated with Sn were placed on a printed circuit board of glass epoxy that was coated with a welding paste and heated in a reflux furnace for perform welding.
    [0053] The soldered printed circuit board was placed in a 2-chamber automatic tester that was set for 30 minutes each, in a low temperature condition of -40Ό and a high temperature condition of + 85Ό. a shear strength test was performed on 150 weld joints initially and removing the printed circuit board at 800 ° cycle, 1200 ° cycle, 1600 ° cycle, and 2000 ° cycle, and the change in resistance in relation to initial resistance was determined.
    [0054] At the lowest resistance in each cycle, a marked percentage decrease in resistance (50% or less from the initial value) or the state in which the resistance became 10 N or less was considered deterioration, and the number of cycles at that point it was registered
    Petition 870180067144, of 08/02/2018, p. 18/27
    15/18 [0055] As can be seen from Table 1, a lead-free solder alloy according to the present invention was exceptionally superior to the lead-free solders of the comparative examples in the drop impact test, and their cycle properties thermal resistance did not show marked deterioration in resistance even after a long period of thermal cycles.
    Test of Changes in Viscosity over Time [0056] Next, the solder powder was prepared using the solder composition of Example 4 in Table 1, and was mixed with a flux, the flux having the composition (mass%) shown in Table 2 to prepare a solder paste. The solder paste was subjected to a weld ball formation test, and was also tested to ascertain changes in the viscosity of the solder paste over time.
    [0057] The weld ball formation test was performed according to HS Z 3284 Appendix 11. In Category 1 and 2 in Figure 1 of HS Z 3284 Appendix 11 was rated as excellent, in Category 3 it was rated as good, and in category 4 it was rated as poor.
    [0058] The changes in the viscosity of the welding paste over time were measured according to HS Z 3284 Appendix 6 using a viscometer Model PCU-205 manufactured by Malcom Co., Ltd. The viscosity was measured at 25Ό at a speed rotation speed of 10 rpm for 10 hours. Samples for which viscosity increased by at least 20% of the initial viscosity were rated as poor, those for which the increase in viscosity was at least 10% unless 20% was rated as good, and those for which the increase in viscosity was less than 10% were rated as excellent. The results of the weld ball formation test and the weld paste viscosity change test over time are shown in Table 2.
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    16/18 [0059] As can be seen from Table 2, despite a solder, according to the present invention, containing In, which easily produces changes in a solder paste, a solder paste having viscosity can be obtained stable. Additionally, there were few solder balls after reflux, and it was possible to obtain solder joints without defects.
    Solder composition Fall impact test (number of falls) Thermal cycle properties OthersSn Ag Ass Bi Sb In 1 rem 0.2 0.6 1.2 0.02 0.01 37 16002 rem 0.3 0.7 1.6 0.02 0.20 45 20003 rem 0.5 0.7 1.6 0.20 0.20 32 20004 rem 1.0 0.7 1.6 0.02 0.20 26 20005 rem 1.0 0.9 2.5 0.10 0.50 25 20006 rem 1.2 0.9 2.5 1.00 1.00 21 20007 rem 0.5 0.8 1.6 0.20 0.50 33 20008 rem 1.0 0.8 1.6 0.02 0.01 23 20009 rem 0.5 0.9 2.0 0.20 0.20 34 200010 rem 0.5 0.6 2.0 0.02 0.20 35 200011 rem 0.5 0.9 2.5 0.20 0.20 41 200012 rem 0.5 0.9 2.5 0.02 0.20 40 20001 rem 0.1 0.5 10.0 0.01 0.01 1 20002 rem 1.0 0.1 - - 0.02 19 1600 DP1 3 rem 1.0 0.5 2.5 - - 15 1200 DP2 4 rem 3.0 1.0 3.0 - 0.80 1 2000 DP2 5 rem 3.0 0.6 3.0 0.60 - 2 2000 DP3 6 rem 1.5 1.0 5.0 2.00 5.00 13 -7 rem 0.5 1.0 1.0 0.20 0.20 36 14008 rem 0.5 0.5 1.0 0.02 0.20 34 14009 rem 1.0 1.0 3.2 0.20 0.20 14 160010 rem 1.5 0.8 3.2 0.02 0.20 11 200011 rem 1.5 0.7 1.6 0.02 0.20 18 2000
    DP: Patent DocumentTable 2
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    17/18
    Comparative Example m 5 00 the o CD 0.5 1.0 1 3.0 100 ô S> Q_ ô S> CL JO42 00 43.0 CD 0.5 0.2 0.2 1 100 Poor Great CO 5 00 39.0 CD 0.5 1.0 4.0 1 100 Great _Q the CL CN00 39.0 CD 0.5 2.0 3.0 1 100 Great Poor O CN00 the o CD 0.5 1.5 2.5 1 100 Great Good 2000 39.0 CD 0.5 1.0 3.5 1 100 Great Good CD00 the o CD 0.5 0.5 3.5 1 100 Good Good CO00 41.0 CD 0.5 0.5 2.5 1 100 Good Great Q. ELU 00 39.5 CD 0.5 1.0 3.5 1 100 Great Good CD00 40.5 CD 0.5 1.0 2.5 1 100 Good Good m00 39.5 CD 0.5 1.5 3.0 1 100 Great Good 00 the o CD 0.5 1.0 3.0 1 100 Great Good CO 5 00 40.5 CD 0.5 0.5 3.0 1 100 Good Great Material Denatured resin Polymerized resin Monohexyl diethylene ether Hardened castor oil Diphenyl guanidineHBr Succinic acid Adipic acid Sebaceous acid Total Formation of solder balls Stability over time
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    18/18
    Industrial applicability [0060] The purpose of the present invention is to increase the impact resistance of tiny weld joints. As applications in which this objective is achieved, a weld according to the present invention can be used for typical welding which includes the formation of weld bosses and can achieve an effect in relation to resistance to impact by drop. When solder balls are formed, a solder is often used in the form of solder balls or solder paste. The resulting miniature solder joints can be repaired using flux-cored solder. It is through this that the effects of the present invention are also exhibited when used in the form of flux-cored solder.
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    1/1
    权利要求:
    Claims (6)
    [1]
    1. Lead-free solder alloy, characterized by the fact that it consists of 0.2 to 1.2% by weight of Ag, 0.6 to 0.9% by weight of Cu, from 1.2 to 3, 0% by weight of Bi, from 0.02 to 1.0% by weight of Sb, from 0.01 to 0.3% by weight of In, and a remainder of Sn, where the percentage of Bi is at least four times the percentage of In.
    [2]
    2. Lead-free solder alloy according to claim 1, characterized by the fact that it consists of 0.2 to 1.0% by weight of Ag, 0.6 to 0.9% by weight of Cu, of 1.2 to 2.0 wt% Bi, 0.1 to 0.5 wt% Sb, 0.01 to 0.3 wt% In, and a remainder Sn.
    [3]
    3. Lead-free solder paste, characterized by the fact that a solder powder from an unleaded solder alloy as defined in claim 1 is mixed with a flux, wherein the flux contains a total of at least 0.5% in mass and less than 5.0% by mass of at least one organic acid selected from succinic acid, adipic acid, and azelaic acid.
    [4]
    4. Flux core solder, characterized by the fact that it comprises a solder wire from an unleaded solder alloy as defined in claim 1 with its center filled with a flux, in which the flux contains at least one organic acid selected from succinic acid, adipic acid, and azelaic acid.
    [5]
    5. Solder sphere, characterized by the fact that it is made of a lead-free solder alloy as defined in claim 1.
    [6]
    6. Welding preform, characterized by the fact that it is made of a lead-free solder alloy as defined in claim 1.
    Petition 870180067144, of 08/02/2018, p. 23/27
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    同族专利:
    公开号 | 公开日
    KR101551050B1|2015-09-07|
    WO2012128356A1|2012-09-27|
    MY162706A|2017-07-14|
    EP2689885A1|2014-01-29|
    KR20140044801A|2014-04-15|
    WO2012127642A1|2012-09-27|
    ES2624621T3|2017-07-17|
    JP5660199B2|2015-01-28|
    DK2689885T3|2017-05-01|
    EP2689885A4|2015-04-01|
    JPWO2012128356A1|2014-07-24|
    CN103561903A|2014-02-05|
    CN103561903B|2017-03-22|
    EP2689885B1|2017-02-22|
    BR112013024398A2|2016-12-13|
    TW201706068A|2017-02-16|
    US20140141273A1|2014-05-22|
    HUE033232T2|2017-11-28|
    US9844837B2|2017-12-19|
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    法律状态:
    2018-07-10| B06A| Patent application procedure suspended [chapter 6.1 patent gazette]|
    2018-10-16| B09A| Decision: intention to grant [chapter 9.1 patent gazette]|
    2018-11-06| B16A| Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]|Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 23/03/2012, OBSERVADAS AS CONDICOES LEGAIS. |
    优先权:
    申请号 | 申请日 | 专利标题
    PCT/JP2011/056903|WO2012127642A1|2011-03-23|2011-03-23|Lead-free solder alloy|
    JPPCT/JP2011/056903|2011-03-23|
    PCT/JP2012/057540|WO2012128356A1|2011-03-23|2012-03-23|Lead-free solder alloy|
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